Laser-Structuring the Conductive Cardboard
After getting an electronic circuit flashing a LED, the next task was to figure out how to enable automated structuring of the economically - and by the way also very ecologically - coated surface of that piece of cardboard. The structuring is needed to provide mutually isolated areas and tracks which will serve as the basis for subsequently mounted circuitry. Also, it seemed necessary to us to evaluate the usability of this cheap process in mass production scenarios this way. However, with the help of Michael Reuter, Semiconductors Engineer, we found a laser configuration which cuts through the conductive zinc layer, but not through the supporting cardboard. But see for yourself:
Here you can look at the structured cardboard’s back side.

